MACHINING TOOL AND METHOD FOR IMPROVING THE WEAR PERFORMANCE OF THE MACHINING TOOL

摘要

The invention relates to the material-removingmachining of wafer-like workpieces, in particular semi-conductor wafers. The subject matter of the invention isa method for achieving a wear performance which is aslinear as possible in the case of a tool which has anessentially planar working surface for the - material-removing machining of wafer-like workpieces, and a toolwhich has a wear performance which is as linear aspossible. The subject matter of the invention is also amethod and a device for measuring a wear profile on anessentially planar working surface for the material-removing machining of wafer-like workpieces. Finally,the subject matter of the invention is also a carrierwhich is used for the two-sided material-removingmachining of wafer-like workpieces.