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ROTATEABLE RACK CIRCLE ROUND, SHAPED SLICE OBJECTS, IN PARTICULAR SEMICONDUCTOR WAFER OR substrates
ROTATEABLE RACK CIRCLE ROUND, SHAPED SLICE OBJECTS, IN PARTICULAR SEMICONDUCTOR WAFER OR substrates
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机译:可旋转的机架圆弧状,切成薄片的物体,特殊的半导体晶片或基板
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摘要
The carrier (1) has an annular jet (8) concentric to its axis in its surface (3,5) which faces a semiconductor wafer (2), for providing a pressurised jet stream, directed radially for supporting the edge of the disc. The surface of the carrier facing the wafer has a stepped edge between the annular jet and the outer edge of the disc, allowing a treatment fluid (15) directed onto the top surface of the wafer to flow around the outer edge and over the peripheral edge region on the underside of the wafer.
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