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ROTATEABLE RACK CIRCLE ROUND, SHAPED SLICE OBJECTS, IN PARTICULAR SEMICONDUCTOR WAFER OR substrates

机译:可旋转的机架圆弧状,切成薄片的物体,特殊的半导体晶片或基板

摘要

The carrier (1) has an annular jet (8) concentric to its axis in its surface (3,5) which faces a semiconductor wafer (2), for providing a pressurised jet stream, directed radially for supporting the edge of the disc. The surface of the carrier facing the wafer has a stepped edge between the annular jet and the outer edge of the disc, allowing a treatment fluid (15) directed onto the top surface of the wafer to flow around the outer edge and over the peripheral edge region on the underside of the wafer.
机译:载体(1)在其面对半导体晶片(2)的表面(3,5)上具有与其轴线同心的环形射流(8),用于提供加压的射流,该射流径向地指向以支撑盘的边缘。载体的面对晶片的表面在环形射流和圆盘的外边缘之间具有阶梯状的边缘,从而允许导向到晶片顶面上的处理液(15)围绕外边缘并流过外围边缘晶圆底面上的区域。

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