首页>
外国专利>
Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance
Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance
展开▼
机译:多层热界面和形成具有低热阻的热界面的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
展开▼