ASSEMBLY OF DOUBLE-SIDE COOLED POWER SEMICONDUTOR DEVICES PROTECTED FROM HARMFUL SURROUNDINGS INFLUENCES

摘要

The assembly of double-side cooled power semiconductor devices protected from harmful surroundings influences, e.g. ingress of foreign bodies, dust and water drops, is composed of one or more semiconductor devices (3), heat sinks positions on both sides (1), mounting clamps (4), and one or more shields (2) suitably inserted between heat sinks (1). Shields (2) enclose the space around semiconductor devices (3), protecting them from harmful surroundings influences. Shields (2) can be inserted either over the outside rims of the heat sink ribs (1), or into the interspace, closer to the semiconductor devices (3). If necessary, an additional single-, or double-side washer (5) is used. One shield (2) can embrace more semiconductor devices (3) in the assembly, or every semiconductor device (3) can have its own shield. Shield (2) is, in principle, realized as a rectangular or a square frame, or it can be in the form of a circle or an elliptical ring, or alike. Shield (2) is made of an insulation material of necessary electrical, mechanical, thermal and chemical characteristics. Its profile is dimensioned and shaped in such a way that it ensures sufficient insulation level and mechanical strength.