SOLUBLE POLYIMIDE AND COMPOSITION COMPRISING THE SAME, BONDING SHEET, ADHESIVE LAMINATED FILM FOR COVERING ACCELERATOR BEAM TUBE, AND ADHESIVE LAMINATED FILM FOR COVERING CONDUCTOR WIRE FOR ACCELERATOR QUENCH HEATER

摘要

A polyimide obtained by reacting an acid anhydride represented by general formula (1) with a compound represented by general formula (2). The polyimide has a solubility of 10% or higher at 20°C even in a low-boiling organic solvent, and has a glass transition temperature of 100 to 250°C and a water absorption of 1.5% or lower. (In the formula (1), X represents -(CH2)k- or a divalent organic group containing an aromatic group; and k is an integer of 1 to 10). (In the formula (2), A represents -NH2 or -NCO; Y's each independently represents -C(=O)-, -SO2-, -O-, -S-, -(CH2)m-, -NHCO-, -C(CH3)2-, -C(CF3)2-, -C(=O)O-, or a single bond; and m and n each is an integer of 0 to 10).