CURABLE RESIN COMPOSITION, MODIFIED COPOLYMER AND RESIN COMPOSITION, AND ALKALI DEVELOPMENT TYPE PHOTOCURABLE GLASS PASTE

摘要

There are provided a curable resin composition having an excellent resist layer formability and ink sensitivity which comprises using a modified copolymer in which an epoxy group-contained unsaturated compound is added to a portion of acid groups in a copolymer primarily containing acrylic acid and a (meth)acrylate as a main comonomer component, a photo and heat curable resin comprising a modified copolymer in which there is employed a specified copolymer having Tg of not less than 50°C, which has an excellent ink sensitivity and a tackfree property, and a composition therefrom, a curable resin composition for a resist having improved various properties to be required, an excellent sensitivity, resolution, and plating resistance which comprises addition or copolymerization of an acrylate monomer having a functional group such as acryloyl morpholine to a copolymer in which β-carboxyethylacrylate is partially employed after or before epoxy modification, and an alkali-developable type photocurable glass paste composition which comprises containing a curable resin, a photopolymerization initiator, a photopolymerizable monomer, a solvent for dilution, and glass frit, in which there can be formed a fine-grained cell barriers pattern on a base plate for a large-sized plasma display panel with a high yield and stable and excellent productivity while keeping good working circumstances.