首页> 外国专利> Cover foil for protecting the copper foil surface of MLB manufacturing process method of MLB using the cover foil

Cover foil for protecting the copper foil surface of MLB manufacturing process method of MLB using the cover foil

机译:用于保护MLB的铜箔表面的覆盖箔使用该覆盖箔的MLB的制造方法

摘要

PURPOSE: A cover foil for protecting a surface of a copper foil of a multilayer board and a multilayer board manufacturing method using the cover foil are provided to shorten manufacturing processes and a manufacturing time by stacking a cover foil on an insulation layer and removing a metal plate of the cover foil. CONSTITUTION: A copper foil(31) is adhered to an insulation layer of a multilayer board. A metal plate(32) is joined in the copper foil(31). A plurality of holes(33) are formed at both sides of the metal plate(32) at predetermined intervals in parallel. The metal plate(32) is overlapped with an upper portion of the copper foil(31). A tape(34) is adhered to an upper portion of the holes(33). An outer cut line(35) is formed at an inner side of the tape(34). An insulation layer is adhered to a copper foil surface of a cover foil(30). The insulation layer, copper foil(31), and metal plate(30) are adhered in order and become an integral form.
机译:用途:提供用于保护多层板的铜箔表面的覆盖箔和使用该覆盖箔的多层板制造方法,以通过将覆盖箔堆叠在绝缘层上并去除金属来缩短制造工艺和制造时间。盖箔板。组成:铜箔(31)粘附在多层板的绝缘层上。金属板(32)接合在铜箔(31)中。在金属板(32)的两侧以预定间隔平行地形成有多个孔(33)。金属板(32)与铜箔(31)的上部重叠。胶带(34)粘附到孔(33)的上部。外切割线(35)形成在带(34)的内侧。绝缘层粘附在覆盖箔(30)的铜箔表面上。绝缘层,铜箔(31)和金属板(30)依次粘接并成为一体。

著录项

  • 公开/公告号KR20010000119A

    专利类型

  • 公开/公告日2001-01-05

    原文格式PDF

  • 申请/专利权人 SUN HO NAM;

    申请/专利号KR20000025761

  • 发明设计人 SUN HO NAM;

    申请日2000-05-15

  • 分类号H05K3/46;

  • 国家 KR

  • 入库时间 2022-08-22 01:14:25

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