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POLYPHENYLENE OLIGOMER, COATING METHOD OF POLYPHENYLENE OLIGOMER, AND PRODUCT CONTAINING CURED PRODUCT OF POLYPHENYLENE OLIGOMER

机译:聚乙烯低聚物,聚乙烯低聚物的涂覆方法以及包含聚乙烯低聚物的固化产物的产品

摘要

PURPOSE: A polyphenylene oligomer composition, a method for preparing an integrated circuit and a coated product from the composition, and an integrated circuit product are provided, which composition has a capability for filling gaps and for flattening a patterned surface, needs a small amount of dispense volume, and is useful as an interlayer dielectric in an integrated circuit. CONSTITUTION: The composition comprises a curable oligomer:£A|w£B|z£EG|v (A is formula(1) and B is formula(2)) selected from a reaction product of at least one polyfunctional compounds containing at least two diene groups and at least one polyfunctional compounds containing at least two compounds containing a dienophile group, and a reaction product of polyfunctional aromatic compounds containing at least one cyclopentadiene group and at least one acetylene group; and s solvent selected from the group consisting of N-methylpyrrolidone, -butyrolactone, mesitylene, cyclohexanone and their mixtures. The curable oligomer has a number average molecular weight of 3,500 or more and a mass average molecular weight of 5,400 or more.
机译:用途:提供一种聚苯撑低聚物组合物,用于由该组合物制备集成电路和涂覆产品的方法以及一种集成电路产品,该组合物具有填充间隙和平坦化图案化表面的能力,需要少量的分配体积,并可用作集成电路中的层间电介质。组成:该组合物包含选自以下的可固化的低聚物:A | w£B | z£EG | v(A为式(1),B为式(2))。两个二烯基和至少一种含有至少两种含亲二烯基的化合物的多官能化合物,以及含有至少一个环戊二烯基和至少一个乙炔基的多官能芳族化合物的反应产物;选自N-甲基吡咯烷酮,-丁内酯,均三甲苯,环己酮及其混合物的溶剂。固化性低聚物的数均分子量为3,500以上,质均分子量为5,400以上。

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