The present invention relates to a morphology analysis method for bulk defects of semiconductor wafers and a morphology analysis method for surface defects.;The morphology analysis method of the bulk defect of the present invention includes a sample preparation step of identifying a location of a bulk defect present in a wafer and marking a predetermined mark in a region near the location of the bulk defect; A sample manufacturing step of preparing a sample capable of analyzing the morphology of the bulk defect; And an analysis step of analyzing the morphology of the bulk defect.;According to the method for analyzing the morphology of the surface defect of the present invention, the position of the surface defect existing at a predetermined depth relative to the surface of the wafer is determined to mark a predetermined mark in the region near the position where the surface defect exists. Sample preparation step to; A sample manufacturing step of preparing a sample capable of analyzing the morphology of the surface defects; And an analyzing step of analyzing the morphology of the surface defects.;Therefore, by accurately identifying the cause of the defect due to the bulk defect and the surface defect, the reliability of the semiconductor device can be improved.
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