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CRITICAL DIMENSION CONTROL IN INTEGRATED CIRCUIT FABRICATION USING PLASMA ETCHING AND PLASMA POLYMERIZATION
CRITICAL DIMENSION CONTROL IN INTEGRATED CIRCUIT FABRICATION USING PLASMA ETCHING AND PLASMA POLYMERIZATION
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机译:等离子体刻蚀和等离子体聚合在集成电路制造中的关键尺寸控制
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摘要
Disclosed herein is a method of etching a first film layer or layers on a wafer. The method can prevent or control critical dimension (CD) microloading and can eliminate or minimize etch bias.
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