HIGH STRENGTH EPOXY RESIN COMPOSITION WHICH IS FAST IN CURING SPEED AT LOW AND ROOM TEMPERATURES, AND FILLING PACKING MATERIALS USING THE SAME

摘要

PURPOSE: Provided is a high strength epoxy resin composition which is fast in curing speed at low and room temperatures, and filing packing materials using the epoxy resin composition. CONSTITUTION: The composition is prepared by the steps of (i) adding a cure catalyst, stiffening agent, colorant, and antiprecipating agent to diglycidyl ether bisphenol A type epoxy resin and butyl glycidyl ether modified epoxy resin to form a liquid mixture, as the first main composition, (ii) adding a hardener to aliphatic modified amine having epoxy group formed by reacting butyl glycidyl ether modified epoxy resin with aliphatic polyamine to form a liquid mixture, as the first hardener composition, and (iii) mixing the first main composition and the first hardener composition in the ratio by weight of 4-6:1. Also, 5-7 parts by weight of quartz sands having a water content of 10% or less, are added to 1 parts by weight of the composition.