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Device for plasma - surface treatment of substrates in the case of simultaneous dc bias potential - - - detecting

机译:直流偏置电位同时检测时对基板进行等离子体表面处理的装置

摘要

Equipment for the surface treatment of at least one flat substrate (3) coated on one side with an electrically non-conducting layer (3a), the other side being the surface to be processed, with a flat substrate electrode (1) of a plasma reactor upon which the substrate (3) is placed on its non-conducting side (3a), and a non-conducting electrode cover (2) fully covering the electrode surface against the plasma forming between the electrodes and having at least one opening for the substrate (3), which is fully surrounded by the cover (2) with the surface to be processed exposed to the plasma. The invention proposes an electrode cover (2) with through-holes (5) to make possible a charge carrier transport between plasma and substrate electrode surface.
机译:用于至少一个在一侧涂覆有非导电层(3a)的平坦基板(3)的表面处理设备,该另一侧是待处理的表面,具有等离子的平坦基板电极(1)反应器,衬底(3)放置在其不导电侧(3a)上,并且不导电电极盖(2)完全覆盖电极表面,以抵抗在电极之间形成的等离子体,并具有至少一个用于电极的开口衬底(3),其被盖子(2)完全包围,并且要处理的表面暴露于等离子体。本发明提出一种具有通孔(5)的电极盖(2),以使电荷载流子在等离子体和衬底电极表面之间的传输成为可能。

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