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Device for plasma - surface treatment of substrates in the case of simultaneous dc bias potential - - - detecting
Device for plasma - surface treatment of substrates in the case of simultaneous dc bias potential - - - detecting
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机译:直流偏置电位同时检测时对基板进行等离子体表面处理的装置
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摘要
Equipment for the surface treatment of at least one flat substrate (3) coated on one side with an electrically non-conducting layer (3a), the other side being the surface to be processed, with a flat substrate electrode (1) of a plasma reactor upon which the substrate (3) is placed on its non-conducting side (3a), and a non-conducting electrode cover (2) fully covering the electrode surface against the plasma forming between the electrodes and having at least one opening for the substrate (3), which is fully surrounded by the cover (2) with the surface to be processed exposed to the plasma. The invention proposes an electrode cover (2) with through-holes (5) to make possible a charge carrier transport between plasma and substrate electrode surface.
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