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Process for measuring the positioning errors of structured patterns used in semiconductor production comprises forming test grating structures, and measuring the light bent at the structures

机译:测量半导体生产中使用的结构化图案的定位误差的过程包括形成测试光栅结构,以及测量在结构上弯曲的光

摘要

Positioning errors of structured patterns are measured by forming test grating structures (4, 7) in at least one plane; measuring light bent at the structures; determining connection between bent light and positioning of both test lattice structures to each other by calibrating and simulating; and determining positioning errors using intensity measurement of bent light of bending level(s). Preferred Process: The test grating structure is produced by etching a metal layer, an insulating layer or a semiconductor.
机译:通过在至少一个平面上形成测试光栅结构(4、7)来测量结构化图案的定位误差。测量弯曲在结构上的光;通过校准和模拟来确定弯曲光与两个测试晶格结构彼此之间的定位之间的联系;并使用弯曲水平的弯曲光的强度测量来确定定位误差。优选方法:通过蚀刻金属层,绝缘层或半导体来制造测试光栅结构。

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