Manufacturing method for electronic device e.g. voltage controlled oscillators, involves forming structure of 3 conductive, 2 insulating layers, and connecting components on first conductive layer to third structured conductive layer

摘要

The method involves connecting circuit elements together by forming a pattern of microstrips on a first conductive layer, separating one of the microstrips as an open transfer line, connecting a resistor to a transistor via one of the microstrips, partly separating and structuring one of the microstrips in the first layer to form an inductive circuit, arranging a first insulation layer beneath the first layer and a second structured conducting layer beneath the insulation layer and connecting it to earth voltage, arranging a further insulating and structured conductive layer with an inductive function below and through connecting component on the first conductive layer to the third structured conductive layer. An Independent claim is also included for an electronic device.