Device for separating/removing thin, breakable, plate-shaped substrates of various formats removes plates using shaking motion in arc about rotation point at base of plate, adhesion point

摘要

The device removes the plates (7) from the adhesion point (5) using a shaking motion in an arc about the rotation point (13) lying at the base of the plate and the adhesion point. The plates are held with suckers (20) arranged in a format-dependent matrix that can be divided into several circuits.