Cover apparatus in thermal print head for facsimile, has holes provided in hob of cover and circuit board provided on surface of heat sink, through which cover is connected to heat sink using bolt

摘要

Circuit board (3) with wiring pattern for external connection is mounted on heat sink (1). The resin made cover (10) is placed opposing the upper surface of heat sink. The hob (11) is provided along longitudinal direction on the undersurface of cover. The cover is connected to the heat sink by fastening a bolt (13) in the hole provided in hob and circuit board.