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Aromatic polyimide laminate, useful for flexible plates with printed circuits, comprises polyimide laminate and metal films and separating foil
Aromatic polyimide laminate, useful for flexible plates with printed circuits, comprises polyimide laminate and metal films and separating foil
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机译:芳香族聚酰亚胺层压板,适用于带有印刷电路的柔性板,包括聚酰亚胺层压板,金属膜和分隔箔
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摘要
Aromatic polyimide laminate comprises an aromatic polyimide laminate film, a metal film, and a separating foil. The aromatic polyimide laminate film comprises an aromatic polyimide substrate film and two thermoplastic aromatic polyimide layers, each of which is bonded to a surface of the substrate film. An aromatic polyimide laminate comprises: an aromatic polyimide laminate film, a metal film and a separating foil (SF). The aromatic polyimide laminate film comprises an aromatic polyimide substrate film and two thermoplastic aromatic polyimide layers, each of which is bonded to a surface of the substrate film. The substrate film has a glass transition temperature Tg of less than 350 deg C, and the thermoplastic aromatic polyimide layer has a Tg of 190-280 deg C. The metal film, not counting the intermediate plastic layer, is bonded to a thermoplastic aromatic polyimide layer with 90 deg peel strength resistance of 0.8 kg/cm or more. The SF, not counting the intermediate plastics layer, is bonded to another thermoplastic aromatic polyimide layer of 90 deg peel strength 0.001-0.5 kg/cm. The second peel strength is half or less than the first strength. Independent claims are included for: (1) production of the polyimide laminate by uniform pressing of the metal film onto one side of the aromatic polyimide laminate film and the SF onto the other side by means of a double band press (sic); (2) preparation of a continuous aromatic polyimide track by continuous and uniform pressing of a metal film track onto one side of an aromatic polyimide laminate film track and the SF onto the other side by means of a double band press (sic).
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机译:芳族聚酰亚胺层压体包括芳族聚酰亚胺层压体膜,金属膜和分隔箔。芳族聚酰亚胺层压膜包括芳族聚酰亚胺基底膜和两个热塑性芳族聚酰亚胺层,每个层均粘结到基底膜的表面。芳香族聚酰亚胺层压体包括:芳香族聚酰亚胺层压体膜,金属膜和隔离箔(SF)。芳族聚酰亚胺层压膜包括芳族聚酰亚胺基底膜和两个热塑性芳族聚酰亚胺层,每个层均粘结到基底膜的表面。基材膜的玻璃化转变温度Tg小于350℃,并且热塑性芳族聚酰亚胺层的Tg为190-280℃。金属膜(不计中间塑料层)结合到热塑性芳族聚酰亚胺上90度抗剥离强度为0.8 kg / cm或更高的涂层。 SF(不计中间塑料层)结合到另一个90度剥离强度为0.001-0.5 kg / cm的热塑性芳族聚酰亚胺层。第二剥离强度是第一强度的一半或更少。包括以下独立权利要求:(1)通过将金属膜均匀地压在芳族聚酰亚胺层压膜的一侧上并将SF均匀地压在另一侧上,通过双频压制法生产聚酰亚胺层压体; (2)通过用双频压机(sic)连续且均匀地将金属膜轨道连续地压在芳族聚酰亚胺层压膜轨道的一侧上和SF在另一侧上来制备连续的芳族聚酰亚胺轨道。
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