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Arrangement for the electromagnetic compatibility (EMC) protection of hybrid components
Arrangement for the electromagnetic compatibility (EMC) protection of hybrid components
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机译:混合组件电磁兼容性(EMC)保护的安排
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摘要
The ceramic carrier (10) has a chip capacitor (14) mounted on it with one terminal linked to a signal line (16) which forms the connection from a plug to the hybrid component. The other terminal is connected to a metallic coating (18) on the upper surface of the carrier, linked to a counterpart (22) on its underside (20) by a plated through hole (24). The entire structure is bonded (26) adhesively to a housing (28). A multilayer structure may be developed with a layer of glass in which the via hole is filled with conductive paste. ADVANTAGE - High frequency coupling to circuit is achieved without metallic housing.
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