A device with an optical component for the integration in batch - proc si first three-dimensional microsystems

摘要

The device has one or more silicon wafers (11) or wafers of similar material such as a semiconductor crystal. Recesses or holes (12) are formed in the wafers by etching or ultrasonic penetration. The holes have different widths (L) with aligned middle points (M1,M2). Alternatively, they have a section (13) formed such that the optical component, e.g. Nd:YAG crystal (10), comes to lie at a defined distance from the underside of the wafer. The wafer surfaces are highly precise and the section is formed very precisely, preferably by etching. Due to this, the optical components are aligned parallel to the lower or upper side of the wafers without them having to be adjusted individually.