plattierungsbad for sn - bi alloy and process for deposition of sn - bi legierungsfilmen

摘要

A Sn-Bi alloy-plating bath comprises (i) Bi ions, (ii) Sn ions, (iii) ions of one metal selected from the group consisting of Cu, Co and Ag, and (iv) one member selected from the group consisting of carboxylic acids, lactone compounds, alkanesulfonic acids, alkanolsulfonic acids, phenolsulfonic acids and salts thereof and is substantially free of lead ions. The bath permits the formation of an Sn-Bi alloy-plated film which does not have an impaired quality even at a temperature higher than about 100 DEG C and which does not result in the formation of whiskers.