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Multiple interconnection thermal/pressure microelectronics circuit connection tool having two section hollow body thermal support held and light source heated with pressure application region cooling channel cooled.
Multiple interconnection thermal/pressure microelectronics circuit connection tool having two section hollow body thermal support held and light source heated with pressure application region cooling channel cooled.
The high temperature pressure connection thermal head has a metallic hollow body (2,3) in two parts on an isolated thermal support (5) with inner cooling fluid channels (6). The thermal head is heated by a light source (1) in the central head section cooled by cooling channels (7) in the region of heat and pressure application (4).
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