首页> 外国专利> Multiple interconnection thermal/pressure microelectronics circuit connection tool having two section hollow body thermal support held and light source heated with pressure application region cooling channel cooled.

Multiple interconnection thermal/pressure microelectronics circuit connection tool having two section hollow body thermal support held and light source heated with pressure application region cooling channel cooled.

机译:多重互连的热/压力微电子电路连接工具,其具有两部分的中空主体热支撑件,并且在压力施加区域冷却通道冷却的情况下加热了光源。

摘要

The high temperature pressure connection thermal head has a metallic hollow body (2,3) in two parts on an isolated thermal support (5) with inner cooling fluid channels (6). The thermal head is heated by a light source (1) in the central head section cooled by cooling channels (7) in the region of heat and pressure application (4).
机译:高温压力连接热敏头在隔离的热支撑(5)上分两部分具有金属空心体(2,3),带有内部冷却液通道(6)。热头由中心头部分中的光源(1)加热,在加热和加压区域(4)中由冷却通道(7)冷却。

著录项

  • 公开/公告号FR2798249A1

    专利类型

  • 公开/公告日2001-03-09

    原文格式PDF

  • 申请/专利权人 DISPLAY CONTROL;

    申请/专利号FR19990011149

  • 发明设计人 HAMPEL REINHARD;

    申请日1999-09-02

  • 分类号H05K3/32;B23K3/047;H05B3/00;

  • 国家 FR

  • 入库时间 2022-08-22 01:07:51

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