ADJUSTING THE ASSEMBLY OF A MINIATURE OPTICAL COMPONENT FORMED BY POSTING AN OPTICAL INTEGRATED CIRCUIT CHIP ON AN OPTICAL FIBER CONNECTION PLATFORM

摘要

The invention concerns a miniature optical component formed by transferring a chip (1) comprising axial (ZZ) optical waveguides (2), onto a platform (3) recessed with axial grooves (4, 4') for positioning optical fibres (5, 5'). The invention is characterised in that a portion of the platform surface corresponding to the site (7) for transferring the chip, is recessed with at least a series of parallel grooves alternating with interposed ridges having a reduced planar summit surface. The recessed grooves (10) at the site (7) for the chip are preferably transverse.