Hyper-frequency integrated circuit electronic module, having additional contacts allowing hyper-frequency testing by use of existing connections between components making up the module

摘要

Electronic module comprises a substrate (32) and one or more connecting lines (38) of characteristic impedance Z0 between two components (34, 36). On the face of the substrate with the connecting line conductor (46) are placed metal contacts plates (52, 54, 56, 58) connected to earthed conductors. The contacts are for carrying out a hyper-frequency test of the components connected to the line. An Independent claim is made for a method for testing integrated circuits at hyper-frequencies.