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Wafer handling robot having X-Y stage for wafer handling and positioning

机译:具有X-Y平台的晶圆搬运机器人,用于晶圆搬运和定位

摘要

An apparatus for handling and positioning wafers or other flat objects. The apparatus has an XY stage with an X-drive and a Y-drive, and a bed attached to the XY stage. A chuck (e.g. a vacuum chuck) is disposed on the bed and an effector is attached to the bed. The effector can rotate about an axis of rotation extending in the Z-direction. The effector can pick up objects and place the objects onto the chuck. The effector can also pick up objects from the chuck. Preferably, the chuck has a recessed region for accommodating the effector so that the effector can be inserted under a flat object on the chuck. The X-drive or Y-drive of the XY stage provides linear motion for the effector so that the effector can pull wafers from a cassette such as used in the semiconductor industry. Alternatively, the effector is attached to a linear actuator disposed on the bed.
机译:一种用于处理和定位晶片或其他平坦物体的设备。该设备具有带有X驱动器和Y驱动器的XY平台,以及附接到XY平台的床。卡盘(例如真空卡盘)设置在床上,并且效应器附接到该床上。效应器可以绕在Z方向上延伸的旋转轴旋转。效应器可以拾取物体并将其放置在卡盘上。效应器还可以从卡盘上拾取物体。优选地,卡盘具有用于容纳执行器的凹入区域,使得执行器可以插入到卡盘上的平坦物体下方。 XY工作台的X驱动器或Y驱动器为效应器提供线性运动,因此效应器可以从诸如半导体行业中使用的盒中拉出晶片。备选地,效应器附接到设置在床上的线性致动器。

著录项

  • 公开/公告号US2001000721A1

    专利类型

  • 公开/公告日2001-05-03

    原文格式PDF

  • 申请/专利权人 BUERMANN DALE;

    申请/专利号US20000747201

  • 发明设计人 DALE BUERMANN;

    申请日2000-12-21

  • 分类号B65G49/06;

  • 国家 US

  • 入库时间 2022-08-22 01:07:37

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