Semiconductor wafer planarizing device and method for planarizing a surface of semiconductor wafer by polishing it

摘要

A semiconductor wafer planarizing device for polishing a surface of a semiconductor wafer comprises a polishing pad having a hard polishing area and a soft polishing area. In a method of planarizing a surface of the semiconductor wafer by using the device, times during which said semiconductor wafer contacts said first area or said second area of the polishing pad is controlled.