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Matching loading between sensing reference and memory cell with reduced transistor count in a dual-bank flash memory

机译:在双排闪存中匹配感测基准和存储单元之间的负载,减少晶体管数量

摘要

A memory integrated circuit (100) includes a first bank (102) of memory cells and a second bank (104) of memory cells. A sensing circuit (114) is coupled to the first and second banks of memory cells to determine a data state of a selected memory cell in relation to a reference cell (118). A loading circuit (206) is coupled with a sensing circuit and associated with the reference cell to approximate loading associated with the selected memory cell. The loading circuit is shared for sensing memory cells of the first bank and memories of the second bank. By sharing the loading circuit, total device count and manufacturing costs where the memory integrated circuit are reduced.
机译:存储器集成电路( 100 )包括存储单元的第一存储体( 102 )和存储单元的第二存储体( 104 )。感测电路( 114 )耦合到第一和第二存储单元库,以确定所选存储单元相对于参考单元( 118 )的数据状态。加载电路( 206 )与感测电路耦合并与参考单元相关联,以近似与所选存储单元相关联的加载。加载电路被共享以用于感测第一存储体的存储单元和第二存储体的存储器。通过共享加载电路,减少了存储器集成电路的总器件数量和制造成本。

著录项

  • 公开/公告号US6259645B1

    专利类型

  • 公开/公告日2001-07-10

    原文格式PDF

  • 申请/专利权人 ADVANCED MICRO DEVICES INC.;

    申请/专利号US20000557728

  • 发明设计人 MING-HUEI SHIEH;TIEN-MIN CHEN;

    申请日2000-04-26

  • 分类号G11C70/20;

  • 国家 US

  • 入库时间 2022-08-22 01:03:52

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