Surface polishing method and apparatus wherein axis of autorotation of workpiece is revolved about an axis within circumscribed circle of the workpiece

摘要

Surface polishing system adapted to polish, lap or grind a surface of a workpiece in a plane such that the workpiece is held in sliding contact with a polishing face of a rotating polishing plate, wherein the workpiece is rotated by a work rotating device about an autorotation axis thereof which is parallel to an axis of rotation of the polishing plate and which lies within the surface of the workpiece, and the autorotation axis of the workpiece is revolved by a work revolving device about a revolving axis which is parallel to the axis of rotation of the polishing plate and which lies within a circumscribed circle of the surface of the workpiece.