Electromagnetic interference cover for an electronics module and an electronic equipment chassis employing the same

摘要

The present invention provides an electromagnetic interference (EMI) module cover for use in an electronics module that is configured to house electrical components that are capable of generating electromagnetic emissions that cause EMI. In one embodiment a conductive sidepanel has a resilient cantilever member formed therefrom with a fixed end that is integrally formed with the sidepanel and a movable end that is free of a module coupler, thereby allowing the resilient cantilever member to flex as the module is installed in a chassis. The resilient cantilever member has a boss that is formed proximate to the movable free end. The boss extends outward from the sidepanel a distance sufficient to provide a conductive path between the conductive sidepanel and an adjacent conductive surface when the module is installed in the chassis.