Flux cleaning for flip-chip technology using environmentally friendly solvents

摘要

A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90 DEG C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.