Electroplate liquid null for PbSn alloy projection electrode formation to semiconductor wafer

摘要

PURPOSE: To provide electrolytic solution capable of forming Pb-Sn alloy protruding electrodes whose heights and shapes are in order, on the surface of a semicoductor wafer. ;CONSTITUTION: An electrolytic solution is composed of aqueous solution whose radioactive isotope content is 50ppb or less and which contains the following; lead methanesulfonate: Pb content of 1-250g/l, tin methanesulfonate: Sn content of 0.1-250g/l, methanesulfonic acid: 20-300g/l, polyoxyethylene polyoxypropylene alkylamine: 1-50g/l, and aldol sulfanilic derivative: 0.1-30g/l.;COPYRIGHT: (C)1996,JPO