PURPOSE: To reduce cost and to improve processing ability by inspecting a plurality of chips on one wafer at once by two or more probe cards. ;CONSTITUTION: A wafer chuck 11 for holding one semiconductor wafer 10 is provided and a card holding part 13 for holding two probe cards 12-1, 12-2 is provided above the chuck 11. Attaching parts 14-1, 14-2 are provided with an insert ring 15-1 for mounting the card 12-1 and an insert ring 15-2 for mounting the card 12-2. The attaching parts 14-1, 14-2 are provided with pin groups 17-l, 17-2 in electrical contact with terminals of the cards 12-1, 12-2. One wiring substrate 21 is inserted between the holding part 13 and a measurement part body 20, and the wiring substrate 21 electrically connects the pin groups 17-1, 17-2 and the measurement part body 20 mutually. The wiring substrate 21 can be replaced with another one of another wiring pattern and can correspond to LSI chips of a wide variety of types.;COPYRIGHT: (C)1995,JPO
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