PROBLEM TO BE SOLVED: To provide a revolution disk whetstone whose external diameter is comparatively large and its thickness is thin, and whose process accuracy is improved by minimizing a deformation of a substrate or an abrasive layer by an effect of a difference of thermal expansion by a temperature difference between the time of shipping and using.;SOLUTION: This invention is related to the revolution disk whetstone which can minimize the deformation of the substrate or the abrasive layer occurred by the difference of thermal expansion at processing, and maintain the state of caulking between the abrasive layer and the substrate, and maintain good processing accuracy not to be effected by the processing stress by using the substrate whose coefficient of linear thermal expansion is higher than that of the abrasive lauer by 1.0×10-6-3.0×10-6/°C.;COPYRIGHT: (C)2002,JPO
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