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ri - do conductor and thin-shaped hiyu - zu null for thin-shaped hiyu - zu

机译:ri-做导体和薄形的hiyu-zu为薄形的hiyu-zu无效

摘要

PROBLEM TO BE SOLVED: To secure quick operation for a long time by a low melting-point fusible alloy piece connected between the tip surfaces of a pair of band-shaped lead conductors each of which is made by forming a copper conductor on a tip surface of a nickel band-shaped body and by sealing the low melting-point fusible alloy piece with a flat insulator. ;SOLUTION: A copper conductor part 22 of a band shaped lead conductor 2 made by forming the copper conductor 22 on the tip surface of a nickel band-shaped body is brought into contact with the back face of an insulating plate 1 and a swelled part 220 is exposed to the surface; a low melting-point fusible alloy piece 3 is connected between the exposed copper conductor parts of a pair of the band-shaped lead conductors by means of welding or the like. Then, the contact part of the insulating plate 1 and the copper conductor parts 22 are bonded together. The low melting-point fusible alloy piece 3 coated with flux 4 is sealed with an insulating film 5 and the insulating plate 1. In this case, since the parts other than the tip surface of the band- shaped lead conductor 2 (the part of the copper conductor 22) is made of nickel, the surfaces exposed to external heat can be maintained as a pure nickel base with little creation of oxide film for a long time. Thereby, the generated heat can be effectively transmitted to the low melting-point fusible alloy piece 3.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:通过连接在一对带状引线导体的尖端表面之间的低熔点可熔合金片,确保长时间快速运行,每个带状引线导体的尖端表面都形成铜导体通过将低熔点可熔合金片用扁平绝缘体密封,制成镍带状体。 ;解决方案:通过在镍带状体的末端表面上形成铜导体22而制成的带状引线导体2的铜导体部分22与绝缘板1的背面和膨胀部分接触220暴露于表面;在一对带状引线导体的一对露出的铜导体部分之间通过焊接等连接低熔点的可熔合金片3。然后,将绝缘板1的接触部分和铜导体部分22接合在一起。涂覆有焊剂4的低熔点可熔合金片3用绝缘膜5和绝缘板1密封。在这种情况下,由于带状引线导体2的尖端表面以外的部分(如果铜导体22)由镍制成,则暴露于外部热的表面可以保持为纯镍基,并且长时间不产生氧化膜。从而,所产生的热量可以有效地传递到低熔点易熔合金件3 。;版权所有:(C)1999,日本特许厅

著录项

  • 公开/公告号JP3260694B2

    专利类型

  • 公开/公告日2002-02-25

    原文格式PDF

  • 申请/专利权人 内橋エステック株式会社;

    申请/专利号JP19980161348

  • 发明设计人 川西 俊朗;

    申请日1993-12-30

  • 分类号H01H37/76;

  • 国家 JP

  • 入库时间 2022-08-22 00:59:22

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