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WIRING PANEL FOR FLOOR HEATING PANEL AND FLOOR-HEATING STRUCTURE

机译:地板采暖板和地板采暖结构的接线板

摘要

PROBLEM TO BE SOLVED: To provide a wiring panel for floor-heating panel and floor-heating structure, in which a wiring panel can be placed without trouble on the floor surface, even if size error exists more or less in the distance between the wiring panel and the floor surface.;SOLUTION: In the wiring panel 2 of the floor heating structure 1, a recess 4 is formed on the surface of a base 3, and a conductive strip material 6 is placed for supplying power source to the heating member of each heating unit panel. The conductive material 6 is placed along the inner surface of the recess 4 by bending the conductive material 6 at its midpoint 6a at the edge 4b and a bending part 4a of the recess 4.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种用于地板采暖板和地板采暖结构的布线板,其中即使布线之间的距离或多或少存在尺寸误差,也可以在地板表面上无障碍地放置布线板。解决方案:在地板采暖结构1的接线板2中,在底座3的表面上形成凹槽4,并放置导电条材料6,以向加热部件供电每个加热单元面板的位置。通过在边缘4b的中点6a处弯曲导电材料6并在凹部4的弯曲部分4a处弯曲,沿凹部4的内表面放置导电材料6; COPYRIGHT:(C)2002,JPO

著录项

  • 公开/公告号JP2002276965A

    专利类型

  • 公开/公告日2002-09-25

    原文格式PDF

  • 申请/专利权人 SEKISUI PLASTICS CO LTD;

    申请/专利号JP20010076793

  • 发明设计人 KOBAYASHI HIDEKAZU;

    申请日2001-03-16

  • 分类号F24D13/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:58:26

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