首页> 外国专利> SAMPLE FOR MOISTURE ADSORPTION MEASUREMENT AND MEASURING METHOD FOR MOISTURE ABSORPTION OF ELECTRONIC COMPONENT AS WELL AS MOUNTING METHOD FOR ELECTRONIC COMPONENT

SAMPLE FOR MOISTURE ADSORPTION MEASUREMENT AND MEASURING METHOD FOR MOISTURE ABSORPTION OF ELECTRONIC COMPONENT AS WELL AS MOUNTING METHOD FOR ELECTRONIC COMPONENT

机译:电子成分吸湿性的测定方法,电子成分的测定方法及安装方法

摘要

PROBLEM TO BE SOLVED: To provide a sample, for moisture absorption measurement, which can enhance the reliability of an electronic component by quantitatively controlling the moisture absorption of the electronic component, to provide a measuring method for the moisture absorption of the electronic component and to provide a mounting method for the electronic component.;SOLUTION: In the mounting method for the electronic component, a relationship between the storage environment, the moisture absorption rate, the reflow heat resistance and the relaibility of the electronic component is grasped (S1), a mounting condition which satisfies the guarantee condition of a component maker and which is suitable for the guarantee condition of a user is set (S2), the sample for moisture absorption measurement is packed in every package unit of the electronic component, its mass is attached so as to be shipped (S3), the mass of the sample for moisture absorption measurement is measured, and the moisture absorption rate of the electronic component is quantitatively controlled (S4).;COPYRIGHT: (C)2002,JPO
机译:要解决的问题:提供用于水分吸收测量的样品,该样品可以通过定量控制电子部件的水分吸收来提高电子部件的可靠性,提供一种电子部件的水分吸收的测量方法,以及解决方案:在电子零件的安装方法中,要掌握电子零件的存放环境,吸湿率,回流耐热性和可靠性之间的关系(S1),设置满足元件制造商的保证条件并且适合用户的保证条件的安装条件(S2),将吸湿率测定用样品包装在电子部件的每个包装单元中,并粘贴其质量。为了进行运输(S3),测量用于水分吸收测量的样品的质量,并测量电子元件的实际吸收率受到定量控制(S4)。;版权:(C)2002,JPO

著录项

  • 公开/公告号JP2002048695A

    专利类型

  • 公开/公告日2002-02-15

    原文格式PDF

  • 申请/专利权人 NEC TOHOKU LTD;

    申请/专利号JP20000235824

  • 发明设计人 KIKUCHI TADASHI;

    申请日2000-08-03

  • 分类号G01N5/02;

  • 国家 JP

  • 入库时间 2022-08-22 00:57:54

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