首页> 外国专利> METHOD OF MANUFACTURING TWO-METAL LAYER TBGA OR FPCB (FBWB) BY REEL TO REEL FROM TAPE OR FLEXIBLE MATERIAL LINED WITH COPPER FOIL ON BOTH SIDES

METHOD OF MANUFACTURING TWO-METAL LAYER TBGA OR FPCB (FBWB) BY REEL TO REEL FROM TAPE OR FLEXIBLE MATERIAL LINED WITH COPPER FOIL ON BOTH SIDES

机译:从两面都贴有铜箔的胶带或柔性材料通过卷到卷制造两层TBGA或FPCB(FBWB)的方法

摘要

PROBLEM TO BE SOLVED: To provide a method of reforming copper foil to the copper foil which does not reflect lasers and drilling blind holes by a direct laser drilling method.;SOLUTION: The copper foil is formed to easily absorb the CO2 laser, to roughen its surfaces, to dye the surfaces black and to reduce a copper thickness in order to lessen energy. Reel-to-reel treatment equipment is internally provided with three chambers for the purposes described above and the copper foil is subjected to each chemical treatment. The copper foil is thus finished to the copper foil which has a copper thickness 1 to 5 μm, surface roughness 1 to 3 μm and black color and permits drilling of only the surface to be irradiated with the laser by the direct laser drilling method.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种将铜箔重整成不反射激光的铜箔的方法,并通过直接激光钻孔方法钻孔;解决方案:形成的铜箔易于吸收CO2激光,使铜箔变粗糙它的表面会染成黑色并减少铜的厚度,以减少能量。为了上述目的,卷对卷处理设备内部设有三个腔室,并且对铜箔进行每种化学处理。因此,将铜箔加工成铜箔,该铜箔的铜厚度为1-5μm,表面粗糙度为1-3μm,并且为黑色,并且仅允许对直接激光照射的表面进行打孔。钻孔方法;版权:(C)2002,JPO

著录项

  • 公开/公告号JP2002206181A

    专利类型

  • 公开/公告日2002-07-26

    原文格式PDF

  • 申请/专利权人 OOTO SHIGETAKA;

    申请/专利号JP20000405013

  • 发明设计人 OOTO SHIGETAKA;

    申请日2000-12-29

  • 分类号C23F1/08;H05K3/00;H05K3/06;

  • 国家 JP

  • 入库时间 2022-08-22 00:57:43

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