首页> 外国专利> LASER BEAM MACHINING DEVICE AND METHOD OF LASER BEAM MACHINING USING TWO-DIMENSIONAL LASER BEAM ARRAY

LASER BEAM MACHINING DEVICE AND METHOD OF LASER BEAM MACHINING USING TWO-DIMENSIONAL LASER BEAM ARRAY

机译:二维激光束阵列的激光束加工装置及激光束加工方法

摘要

PROBLEM TO BE SOLVED: To provide a laser beam machining device and a method of laser beam machining using a two-dimensional laser beam array, by which device and method a high speed laser beam machining is possible and the precision of the laser beam machining is excellent. SOLUTION: In the device for laser beam machining which applies laser beam machining to a work using a laser beam, a laser beam generation source is formed which is composed of a two-dimensional laser beam array in which laser beam generation elements are arrayed in a plane and in a matrix, the laser beam generation device is located opposed to a mounting table on which a work is mounted, and a matrix ignition control means, which ignites each laser beam generation elements according to the shape of the machining of the work, is connected to the laser beam generation device.
机译:解决的问题:提供一种使用二维激光束阵列的激光束加工装置和激光束加工方法,通过该装置和方法,可以进行高速激光束加工,并且激光束加工的精度为优秀的。 SOLUTION:在将激光束加工到使用激光束的工件上的激光束加工设备中,形成了一个激光束发生源,该源由二维激光束阵列组成,其中二维激光束发生元件排列在一个激光束发生装置在平面内和矩阵中与安装有工件的安装台相对,并具有矩阵点火控制装置,该矩阵点火控制装置根据工件的加工形状来点燃每个激光束发生元件,与激光束发生装置连接。

著录项

  • 公开/公告号JP2002028794A

    专利类型

  • 公开/公告日2002-01-29

    原文格式PDF

  • 申请/专利权人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD;

    申请/专利号JP20000217254

  • 发明设计人 UEHARA MINORU;MATSUZAKA FUMIO;

    申请日2000-07-13

  • 分类号B23K26/00;B23K26/06;H01S3/00;H01S3/23;

  • 国家 JP

  • 入库时间 2022-08-22 00:57:27

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