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METHOD FOR MOLDING EPOXY RESIN MOLDING BY HIGH SPEED INJECTION-FILLING

机译:高速注胶法模塑环氧树脂的方法

摘要

PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin molding in which a filling time can be shortened, a mold closing time (an injection time + a curing time) is shortened, and a molding cycle is shortened approximately to that of a thermoplastic resin.;SOLUTION: In the method for molding the epoxy resin molding, when an epoxy resin composition is supplied to mold the molding, the composition is supplied at a speed of at least 3.5 cc/s. The composition having latent curing characteristics in which the gelation time of the composition at 100°C is at least 1,000 s, and the activation energy of the composition is at least 12,000 cal/mol is used.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种环氧树脂成型体的制造方法,该方法可以缩短填充时间,缩短合模时间(注射时间+固化时间),并且成型周期可以缩短到大约溶液:在环氧树脂模制品的模制方法中,当提供环氧树脂组合物模制模制品时,以至少3.5cc / s的速度供给组合物。使用具有潜在固化特性的组合物,其中该组合物在100℃的胶凝时间为至少1,000 s,并且该组合物的活化能为至少12,000 cal / mol 。;版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP2002036316A

    专利类型

  • 公开/公告日2002-02-05

    原文格式PDF

  • 申请/专利权人 MITSUI CHEMICALS INC;

    申请/专利号JP20000223802

  • 发明设计人 TOGASHI EIKI;SUZUKI YOHEI;

    申请日2000-07-25

  • 分类号B29C45/46;B29C45/77;C08G59/62;C08K3/00;C08L63/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:55:52

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