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CUTTING METHOD OF SOLID MATERIAL AND CUTTING DEVICE OF SOLID MATERIAL THEREFOR

机译:固体材料的切割方法及固体材料的切割装置

摘要

PROBLEM TO BE SOLVED: To provide a cutting method of a solid material and a cutting device of the solid material therefor extremely reducing an error in the cutting thickness, accurately cuttable in the uniform cutting thickness, capable of selecting the optional cutting thickness, limiting no cutting number and reducing a cost.;SOLUTION: Two guide rollers for peripherally arranging shaft directionally mutually separate plural groove parts on the outer periphery are separately arranged at specific intervals, and a single cutting fiber is supplied in an extended state with every interval of the corresponding groove parts of the two guide rollers, and while supplying a grinding agent to the cutting fiber, the solid material is cut.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种固体材料的切割方法和一种固体材料的切割装置,从而极大地减少了切割厚度的误差,可以均匀切割厚度准确地切割,能够选择可选的切割厚度,而不会限制解决方案:解决方案:两个导向辊用于在圆周方向上沿轴方向相互独立地布置在外周上的多个凹槽部分,它们以特定的间隔分开布置,并且在每个间隔的间隔中以延长的状态提供单根切割纤维两个导辊的相应凹槽部分,在向切割纤维提供研磨剂的同时,对固体材料进行切割。;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001347448A

    专利类型

  • 公开/公告日2001-12-18

    原文格式PDF

  • 申请/专利权人 CRYSTAL SYSTEM:KK;

    申请/专利号JP20000167547

  • 发明设计人 SHINDO ISAMU;

    申请日2000-06-05

  • 分类号B24B27/06;B28D5/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:55:48

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