B-STAGE RESIN SHEET WITH DOUBLE-SURFACE TREATED COPPER FOIL SUITABLE FOR CARBON DIOXIDE LASER PERFORATION, AND PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a B-stage resin sheet with a copper foil which can be perforated by the direct irradiation with carbon dioxide laser.;SOLUTION: A sheet wherein a B-stage resin layer, which is obtained by applying a polyfunctional cyanic ester resin composition preferably compounded with 10-80 pts.wt. of an inorganic insulating filler to the opposite surface of a double-surface treated copper foil to which nickel treatment or nickel alloy treatment is preferably applied to dry the coating layer, is bonded on carbon dioxide laser irradiation side and the printed wiring board using this sheet are provided. The surface of the copper foil preferably subjected to nickel treatment or nickel alloy treatment of the copper clad sheet obtained using the sheet is directly irradiated with high output carbon dioxide laser of which the energy is preferably 10-60 mJ to process and remove outer and inner copper foil layers to form through-holes and/or blind viaholes with a pore size of 80-180 μm. Thereafter, the burr generated on the upper and rear surfaces of the copper foil and the inner copper layer and a part of the surface layer of the copper foil is removed by etching to adjust the thickness of the copper clad sheet to 2-7 μm. The copper clad sheet obtained by performing copper plating is used to form a high density printed wiring board. The B-stage resin sheet with the double-surface treated copper foil to which through-holes and/or blind viaholes can be formed by the direct irradiation with carbon dioxide laser can be obtained.;COPYRIGHT: (C)2001,JPO