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METHOD FOR PRODUCING SILICON CARBIDE DUMMY WAFER AND SILICON CARBIDE DUMMY WAFER

机译:制备碳化硅钝化晶片和碳化硅钝化晶片的方法

摘要

PROBLEM TO BE SOLVED: To provide a production method in which a microcrack is coated with an SiC film and the generation of particulate is prevented, and to provide a dummy wafer made of silicon carbide which does not have a bad influence upon a silicon wafer.;SOLUTION: In this method for producing a silicon carbide dummy wafer used in the process of producing a semiconductor device, a silicon carbide dummy wafer is produced by subjecting both sides of a silicon carbide dummy wafer substrate to machining for obtaining the thickness thinner than the finished dimensions of the dummy wafer and thereafter coating the whole with the material same as that of the base metal of the dummy wafer by a CDV method.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种制造方法,在该方法中,微裂纹覆盖有SiC膜,并且防止了微粒的产生,并且提供了一种由碳化硅制成的虚设晶片,该虚设晶片对硅晶片没有不良影响。 ;解决方案:在该用于制造半导体器件的过程中使用的碳化硅虚设晶片的方法中,通过对碳化硅虚设晶片基板的两侧进行机械加工以获得比厚度薄的厚度来制造碳化硅虚设晶片。成品晶片的最终尺寸,然后通过CDV方法用与原型晶片的贱金属相同的材料涂覆整个材料。;版权:(C)2001,JPO

著录项

  • 公开/公告号JP2001323372A

    专利类型

  • 公开/公告日2001-11-22

    原文格式PDF

  • 申请/专利权人 MITSUI ENG & SHIPBUILD CO LTD;ADMAP INC;

    申请/专利号JP20000140168

  • 发明设计人 KAWAMOTO SATOSHI;

    申请日2000-05-12

  • 分类号C23C16/32;C04B35/565;H01L21/205;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:43

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