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METHOD FOR CALIBRATING THERMAL TREATING DEVICE AND FOR FORMING AND CALIBRATING MATHEMATICAL MODEL THEREOF

机译:校准热处理装置及其数学模型的形成和校准方法

摘要

PROBLEM TO BE SOLVED: To calibrate and form a mathematical model to estimate the temperature of a substance to be treated.;SOLUTION: A method for forming a temperature estimated mathematical model for the thermal treating device formed that the output of a temperature sensor situated in a heating furnace is applied for a temperature estimated mathematical model to estimate the temperature of a wafer, and the heating furnace is controlled according to an estimated temperature. N-sets of temperature sensors are situated in positions of R1...Rn where a distance from a wafer center satisfies a formula 1. The wafers are contained in the heating furnace and by obtaining the outputs of the sensor of the heating furnace and the output of the sensor of a wafer, a temperature estimated mathematical model is produced. Through similar processing, a relation between an actual measurement and an estimated value is determined to calibrate the temperature estimated mathematical model. Formula 1 is K1.πR12=...=Kn+1.π(R2-Rn2), where K1-Kn+1 is a yield of an element with which a distance from a wafer center is obtained from n+1 regions intercepted by a circle of R1-Rn.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:校准并形成数学模型以估算待处理物质的温度;解决方案:一种用于形成热处理设备的温度估算数学模型的方法是,将温度传感器的输出置于将加热炉用于温度估计数学模型以估计晶片的温度,并根据估计的温度控制加热炉。 N组温度传感器位于R1 ... Rn位置,此处距晶片中心的距离满足公式1。通过加热炉中传感器的输出和晶片的输出来容纳晶片。晶片传感器的输出,产生温度估计的数学模型。通过类似的处理,确定实际测量值与估计值之间的关系以校准温度估计数学模型。式1为K1·R12 = ... = Kn + 1·(R2-Rn2),其中,K1-Kn + 1是从n +获得到晶片中心的距离的元素的屈服率。 1个区域,被一个R1-Rn圆拦截。;版权:(C)2002,JPO

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