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OPTICAL PACKAGING SUBSTRATE, OPTICAL MODULE, OPTICAL TRANSMITTING AND RECEIVING DEVICE, OPTICAL TRANSMITTING AND RECEIVING SYSTEM AND MANUFACTURING METHOD OF THE SUBSTRATE
OPTICAL PACKAGING SUBSTRATE, OPTICAL MODULE, OPTICAL TRANSMITTING AND RECEIVING DEVICE, OPTICAL TRANSMITTING AND RECEIVING SYSTEM AND MANUFACTURING METHOD OF THE SUBSTRATE
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机译:光学包装基质,光学模块,光学传输和接收设备,光学传输和接收系统以及该基质的制造方法
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摘要
PROBLEM TO BE SOLVED: To solve the problem associated with the high cost of silicon substrate process and a complex optical waveguide manufacturing process which are required to realize giga bit class high speed operations for an optical module employing a conventional PLC platform.;SOLUTION: An optical waveguide groove 11 is provided on a glass substrate 17 which has a lower loss in high frequency. Moreover, via holes 12 are provided in the thickness direction of the substrate for wiring connections or heat radiation.;COPYRIGHT: (C)2002,JPO
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