A pellicle for protecting a reticle, on which a circuit pattern is formed for manufacturing a semiconductor device, from an attachment of a foreign matter, comprising: a pellicle film having a predetermined thickness, through which a light transmits to the reticle; and a pellicle frame, on which a periphery of the pellicle film contacts, including: a body part having a frame shape, the height of which is substantially constant all over the body part; and an upper protruding part formed on an upper end of the body part that protrudes upward from the upper end of the body part for directly contacting with a surface of the pellicle film, the height of the upper protruding part being constant all over the upper protruding part.
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