Cleaning method for copper dual damascene process

摘要

A cleaning method for a copper dual damascene process, applicable for cleaning a structure having a dual damascene opening. The method begins with preparing a first chemical solution and a second chemical solution. The first chemical solution includes a deionized water, a hydrogen peroxide, and a surfactant, whereas the second chemical solution includes a deionized water, a hydrogen fluoride, and a hydrogen chloride. A first cleaning step is performed using the first chemical solution to remove particles and polymers that remain on a surface of a copper layer and the dual damascene opening. This is followed by performing a second cleaning step using the second chemical solution to remove a copper oxide layer on the copper layer.