首页> 外国专利> Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through life

Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through life

机译:制造用于镍及类似磁性金属的磁控溅射的靶材,以形成具有始终如一的均匀性的金属化膜

摘要

Improved targets for use in DC magnetron sputtering of nickel or like ferromagnetic face-centered cubic (FCC) metals are disclosed for forming metallization films having effective edge-to-edge deposition uniformity of 5% (3&sgr;) or better. Such targets may be characterized as having: (a) a homogeneous texture mix that is at least 20% of a 200 texture content and less than 50% of a 111texture content, (b) an initial pass-through flux factor (%PTF) of about 30% or greater; and(c) a homogeneous grain size of about 200 &mgr;m or less.
机译:公开了用于镍或类似铁磁面心立方(FCC)金属的DC磁控管溅射中使用的改进靶,用于形成具有有效边缘到边缘沉积均匀性为5%(3s)或更高的金属化膜。这样的目标可以被表征为具有:(a)均质的纹理混合物,其至少为<200>纹理含量的20%而小于<111>纹理含量的50%,(b)初始通过通量约30%或更大的系数(%PTF); (c)约200μm或更小的均匀晶粒尺寸。

著录项

  • 公开/公告号US6436207B1

    专利类型

  • 公开/公告日2002-08-20

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIAL INC.;

    申请/专利号US20000566657

  • 发明设计人 MURALI ABBURI;SESHADRI RAMASWAMI;

    申请日2000-05-08

  • 分类号C23C143/50;C22F11/00;

  • 国家 US

  • 入库时间 2022-08-22 00:49:28

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