Rubber for hot press cushioning pad, manufacturing method thereof, hot press cushioning pad and method of manufacturing printed circuit board

摘要

A rubber for a hot press cushioning pad having a value of loss tangent (tan ) in accordance with dynamic viscoelasticity measurement of at most 0.04, wherein the temperature condition is set at a hot press temperature ranging from 150 C. to 300 C., and the frequency condition is set to a time period of one press cycle ranging from 1 to 210⁴ seconds.