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Common mode choke coil of the conductor/insulator stacked type that uses a high machinability substrate and benzocyclobutene as the insulator

机译:导体/绝缘体叠层型的共模扼流圈,使用高切削性的基材和苯并环丁烯作为绝缘体

摘要

An electronic component comprises an insulator substrate (11), a layered member composed of a plurality of insulator resin layers (12a-12f) and a plurality of conductor pattern layers (13a-13f) alternately stacked on the insulator substrate to form a first conductor line and a second conductor line each of which comprises at least one conductor layer, first and second external electrode terminal portions connected to opposite ends of the first conductor line and covering first and second areas of side surfaces of said layered member and the insulator substrate, respectively, and a third external electrode terminal portion connected to one end of the second conductor line and covering a third area of the side surfaces of the layered member and the insulator substrate. The second conductor lines have magnetic and electrocapacitive coupling with respect to the first conductor line.
机译:电子部件包括绝缘体基板( 11 ),由多个绝缘体树脂层( 12 a - 12 f )和多个导体图案层( 13 a - 13 f )交替地堆叠在绝缘体基板上,以形成第一导体线和第二导体线,它们各自包括至少一个导体层,连接到第一导体线的相对端的第一和第二外部电极端子部分以及分别覆盖所述层状构件和绝缘体基板的侧表面的第一和第二区域,以及连接到第二导线的一端并覆盖层状构件和绝缘体的侧表面的第三区域的第三外部电极端子部分。绝缘体基板。第二导线相对于第一导线具有磁电容耦合和电容电容耦合。

著录项

  • 公开/公告号US6376912B1

    专利类型

  • 公开/公告日2002-04-23

    原文格式PDF

  • 申请/专利权人 TOKIN CORPORATION;

    申请/专利号US19990298437

  • 发明设计人 KAZUHIRO SETO;

    申请日1999-04-23

  • 分类号H01L234/80;H01L235/20;H01L294/00;

  • 国家 US

  • 入库时间 2022-08-22 00:48:22

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