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Construction and application for non-volatile, reprogrammable switches

机译:非易失性可重编程开关的构造和应用

摘要

The present invention includes a DRAM technology compatible non-volatile, reprogrammable switch formed according to an DRAM optimized process flow. The non-volatile, reprogrammable switch includes a non-volatile memory cell. The non-volatile memory cell includes a first metal oxide semiconductor field effect transistor (MOSFET) formed in a semiconductor substrate. A capacitor is formed in a subsequent layer above the first MOSFET and is separated from the MOSFET by an insulator layer. A vertical electrical via couples a bottom plate of the capacitor through the insulator layer to a gate of first MOSFET. A second MOSFET is formed in the semiconductor substrate. The gate of the first MOSFET also serves as a gate of the second MOSFET. Additional MOSFETs can be combined in a similar fashion with the non-volatile cell to create a new, powerful logic cell that is smaller and more robust than conventional circuit solutions. The present invention includes applications such as a very size efficient address decode tree, data routing device, or other applications such as used in DRAM redundancy schemes. Methods for forming and using the present invention are also included. The need for intervening sense amps normally required to read the status of a non-volatile memory cell (e.g. an EEPROM cell) and communicate this to additional logic that would then in turn control the status of one or more switches is eliminated. Thus, the requirements of low power densely packed integrated circuits is realized for smaller, portable microprocessor devices.
机译:本发明包括根据DRAM优化的工艺流程形成的与DRAM技术兼容的非易失性,可重新编程的开关。非易失性可重编程开关包括非易失性存储单元。非易失性存储单元包括形成在半导体衬底中的第一金属氧化物半导体场效应晶体管(MOSFET)。电容器形成在第一MOSFET上方的后续层中,并且通过绝缘体层与MOSFET分开。垂直电通孔通过绝缘层将电容器的底板耦合到第一MOSFET的栅极。在半导体衬底中形成第二MOSFET。第一MOSFET的栅极也用作第二MOSFET的栅极。可以将其他MOSFET以类似的方式与非易失性单元组合,以创建一个新的,功能强大的逻辑单元,该逻辑单元比常规电路解决方案更小,更坚固。本发明包括诸如非常高效的地址解码树,数据路由设备之类的应用,或者诸如诸如DRAM冗余方案中所使用的其他应用。还包括形成和使用本发明的方法。消除了通常需要读取读出非易失性存储单元(例如EEPROM单元)状态并将其传达给其他逻辑的感测放大器的需要,这些逻辑随后将控制一个或多个开关的状态。因此,对于较小的便携式微处理器设备实现了低功率密集封装集成电路的要求。

著录项

  • 公开/公告号US6319773B1

    专利类型

  • 公开/公告日2001-11-20

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US20000517036

  • 发明设计人 WENDELL P. NOBLE;EUGENE H. CLOUD;

    申请日2000-03-02

  • 分类号H01L218/247;

  • 国家 US

  • 入库时间 2022-08-22 00:47:59

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