The adhesive composition activated by moisture, the process paraligau00e7u00e3o multiple substrates, and product demadeira engineered

摘要

"Adhesive composition activated by moisture, the process for connection of multiple substrates, and wood product engineered".Composiu00e7u00e3oadesiva activated by moisture, comprising the product of reau00e7u00e3ode: (a) a poliisocianato selected from (a) a mixture of mdipolimu00e9rico and pure MDI and / or (b) a prepolymer terminated EMISOcianato; (b) a component reactive to at least one group isocianatocompreendendo aliphatic tertiary amino polyol contendogrupo made by alcoxilau00e7u00e3o ouaminou00e1lcoois amines.Characterized by the fact that the total content by weight of the composition deetileno oxide adhesive total is more than 2.5%.